
Silicon & AI
Optical Backplanes Replace Copper Inside Liquid-Cooled Inference Racks
Hyperscale cluster operators are swapping twinax copper trays for co-packaged silicon photonics as rack power envelopes cross 130 kilowatts.
Hardware-level reporting on accelerator packaging, optical backplanes, foundry capacity, and quantized enterprise model deployments.
Desk Editor: Clara Vandenberg

Hyperscale cluster operators are swapping twinax copper trays for co-packaged silicon photonics as rack power envelopes cross 130 kilowatts.
Logistics and manufacturing IT teams are distilling frontier checkpoints into 8-billion-parameter task models that run locally on dual-card PCIe servers.
One concise morning dispatch unpacking wafer packaging, private infrastructure debt, HVDC grid queues, and industrial software—zero press-release rewrites.