Chief Silicon Correspondent · Amsterdam & San Francisco · clara.vandenberg@example.test
Clara covers semiconductor packaging, rack-scale photonics, and enterprise inference economics. Prior to joining Kestrel Wire, she spent seven years reporting on European lithography supply chains and data center thermal engineering.
Hyperscale cluster operators are swapping twinax copper trays for co-packaged silicon photonics as rack power envelopes cross 130 kilowatts.
Logistics and manufacturing IT teams are distilling frontier checkpoints into 8-billion-parameter task models that run locally on dual-card PCIe servers.